PMMI, The Association for Packaging and Processing Technologies
A family of scholarships, most worth $5,000, for students at North American colleges studying engineering, packaging, processing, mechatronics or related fields, generally requiring a 3.0 GPA. Named awards include the PACK EXPO Scholarships (six at $5,000), Mechanical Engineer, Electrical Engineer, Processing, John A. Kowal Memorial and Chuck Yuska scholarships, plus a $4,000 award for two-year program students planning careers in packaging and processing machinery manufacturing. The 2026 cycle has closed and 2027 scholarships open in January 2027.