Undergraduate Engineering Funding Available

IMAPS Microelectronics Foundation Student Travel Grant

IMAPS Microelectronics Foundation

Official Website imaps.org

About This Program

A $2,000 travel award (plus hotel and conference fees) for full-time North American students in microelectronics packaging programs who present a paper or poster at the IMAPS Symposium or Device Packaging Conference.

Program Details

Field
Engineering
Level
Undergraduate
Country
United States
Institution
IMAPS Microelectronics Foundation
Online Available
In person
Funding / Award
Yes
Women-Only Program
Open to all; women encouraged

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