Undergraduate Engineering Funding Available

ASU Semiconductor Packaging REU

Arizona State University

About This Program

A 6-week NSF Research Experience for Undergraduates focused on advanced semiconductor packaging and heterogeneous integration, working in ASU's Nanofab and MacroTechnology Works facilities with industry partners including Intel. Participants receive a $4,000 stipend and on-campus housing; the program targets undergraduates in electrical, computer, materials or mechanical engineering, physics and related fields (24 students per cohort).

Program Details

Field
Engineering
Level
Undergraduate
Country
United States
State / Province
Arizona
Institution
Arizona State University
Online Available
In person
Funding / Award
Yes
Women-Only Program
Open to all; women encouraged

← Back to Programs